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Following its strategy of partnering with large local companies, with strong commercial presence and technological background, Mind and Youth Hitech Co., Ltd. signed a distribution agreement concerning Mind Technology solutions for the footwear industry in South Korea.
Mind sponsors 2D and 3D CAD design and engineering training at Iasi University, at Romania, giving the students superior exposure to the latest advances in specialized CAD software for designing, modelling and manufacturing footwear and leather goods.
Mind was present and exhibited its Mind Technology solutions at the International Fair Shoes & Leather Guangzhou 2014, held on 28-30 May 2014, in Guangzhou, P.R. China.
FESPA 2026 is the must-attend event for the printing industry. In May, it returns to Barcelona!
Mind will be present at Empack & Logistics & Automation Porto 2026, at Exponor (Porto), the meeting point to discover the latest trends and solutions in packaging, logistics, and automation.
From March 10–12, the global composites industry will gather in Paris to explore the latest trends, innovations, and technologies shaping efficient and future-ready production workflows.